Product Index

Filters

Manufacturer

  • Maxim Integrated
  • Microchip Technology
  • NXP Semiconductors
  • onsemi
  • Texas Instruments

Series

  • *
  • -
  • Automotive, AEC-Q100
  • Automotive, AEC-Q100, SmartFusion®2
  • DARWIN
  • Geode™
  • Jacinto™
  • KeyStone Multicore
  • PolarFire®
  • SmartFusion®
  • SmartFusion®2

Package

  • Bulk
  • Strip
  • Tape & Reel (TR)
  • Tray

Product Status

  • Active
  • Last Time Buy
  • Not For New Designs
  • Obsolete

Architecture

  • -
  • DSP, MCU, MPU
  • DSP, MPU
  • MCU
  • MCU, FPGA
  • MCU, MPU
  • MPU
  • MPU, FPGA

Core Processor

  • -
  • ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
  • ARM® Cortex®-A72, ARM® Cortex®-R5F
  • ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
  • ARM® Cortex®-M0+
  • ARM® Cortex®-M3
  • ARM® Cortex®-M4
  • ARM® Cortex®-M4, C66x
  • ARM® Cortex®-M4F
  • C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
  • Dual ARM® Cortex®-A15 MPCore™ with CoreSight™
  • Dual ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
  • RISC-V
  • x86

Flash Size

  • -
  • 128KB
  • 128kB
  • 256KB
  • 512KB
  • 512kB

RAM Size

  • -
  • 1.4125MB
  • 1.5MB
  • 128KB
  • 128kB
  • 1MB
  • 2.2MB
  • 2.5MB
  • 230.4KB
  • 2MB
  • 3.95MB
  • 3MB
  • 512kB
  • 64KB
  • 857.6KB
  • 857.6kB

Primary Attributes

  • -
  • FPGA - 10K Logic Modules
  • FPGA - 150K Logic Modules
  • FPGA - 161K Logic Modules
  • FPGA - 23K Logic Modules
  • FPGA - 254K Logic Modules
  • FPGA - 25K Logic Modules
  • FPGA - 461K Logic Modules
  • FPGA - 50K Logic Modules
  • FPGA - 5K Logic Modules
  • FPGA - 60K Logic Modules
  • FPGA - 90K Logic Modules
  • FPGA - 93K Logic Modules
  • ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

Operating Temperature

  • -
  • -30°C ~ 85°C
  • -40°C ~ 100°C
  • -40°C ~ 100°C (TC)
  • -40°C ~ 100°C (TJ)
  • -40°C ~ 105°C
  • -40°C ~ 105°C (TA)
  • -40°C ~ 105°C (TJ)
  • -40°C ~ 125°C (TJ)
  • -40°C ~ 85°C (TA)
  • -55°C ~ 125°C (TJ)
  • 0°C ~ 100°C
  • 0°C ~ 100°C (TC)
  • 0°C ~ 100°C (TJ)
  • 0°C ~ 85°C (TC)
  • 0°C ~ 85°C (TJ)

Peripherals

  • -
  • AC97/AMC97, DMA, PCI, SmartCard, WDT
  • DDR
  • DDR, DMA, I2C, I2S, JTAG, PCIe, PWM, USB, WDT
  • DDR, DMA, PCIe, POR, WDT
  • DDR, PCIe, SERDES
  • DMA, I²S, PWM, WDT
  • DMA, PCI, PWM
  • DMA, POR, PWM, WDT
  • DMA, POR, WDT
  • DMA, PWM, WDT
  • I²S, PWM, WDT

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Products - Record(s)

Bushings, Grommets

Bushinas and Grommets are used to insulate between an opening in a panel and anycharacteristics are bushing/grommet type, panel thickness, panel cutout dimensions,diameterinside and materie<br />(most often cables and wire) that are inserted into the opening. These devices can also hold the inserted objects securely between the two sides of the opening. The