Product Index

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Manufacturer

  • Analog Devices Inc.
  • Maxim Integrated
  • Microchip Technology
  • onsemi
  • Silicon Labs
  • STMicroelectronics
  • Texas Instruments

Series

  • *
  • -
  • AD816
  • AD8375
  • ADL5306
  • ADL5561
  • ADL6316
  • AMC0x11D
  • AMC0x11S
  • Automotive
  • Automotive, AEC-Q100
  • iCoupler®
  • LMH6521
  • Precision Edge®
  • Super-Block™
  • TLV2304
  • X-AMP®

Package

  • Box
  • Bulk
  • Cut Tape (CT)
  • Strip
  • Tape & Reel (TR)
  • Tray
  • Tube

Product Status

  • Active
  • Discontinued at
  • Last Time Buy
  • Obsolete

Type

  • -
  • ADC Driver
  • Amplifier
  • Amplifier, Comparator
  • Amplifier, Comparator, Reference
  • Differential
  • Differential Receiver
  • Driver
  • Isolated
  • Isolation
  • Isolation Amplifier
  • Isolator, Error Amplifier
  • Limiting Amplifier
  • Limiting Postamplifier
  • Limiting-Logarithmic Amplifier
  • Logarithmic Amplifier
  • Logarithmic and Log Ratio
  • Logarithmic Converter
  • Postamplifier
  • Preamplifier
  • Programmable Gain
  • Receiver
  • Sample and Hold
  • Transconductance
  • Transconductance, Variable Gain Amplifier
  • Transimpedance Amplifier
  • Transimpedance Preamplifier
  • Transmit Variable Gain Amplifier (VGA)
  • Ultrasound Receivers
  • Variable Gain
  • Variable Gain Amplifier
  • Video Switch

Applications

  • -
  • Audio
  • Automatic Gain Control, Voltage-Controlled Oscillators
  • Automatic Test Equipment (ATE)
  • Automotive
  • Automotive, Inverters, Power Supplies, UPS
  • Automotive, LIDAR Receivers, Optical
  • Bluetooth, Cordless Phones
  • BOSA, GPON/EPON ONU
  • CATV
  • Cellular Phones, Digital Dictation Devices, Headsets, Hearing Aids, Portable Computing
  • Commercial TV Cameras, Radar Switching
  • Communication
  • Crystal Oscillator
  • Current Sensing, DC/DC Converter, Inverters
  • Current Sensing, Power Management
  • Data Acquisition
  • Data Concentrators, Differential DSL Line Drivers, Home Networking PLC
  • Data Quantizer, Optical Receivers
  • DC/DC Converter
  • Driver
  • Driver, Cellular Base Stations
  • Driver, Inverters, Power Supplies
  • Driver, Ultrasonic Signal Receivers
  • Ethernet
  • Ethernet, Optical Networks
  • Fiber Optics
  • FTTx and Media Converters
  • GPON, OLT Receivers
  • GPON, ONU Receivers
  • GSM
  • Inverters, Power Supplies
  • Isolated Voltage Sensing
  • LIDAR Receiver, Industrial Imaging
  • LIDAR Receivers
  • LIDAR, Industrial Imaging
  • Limiting Amplifier
  • LTE
  • Medical Imaging
  • Medical Ultrasound Imaging, Sonar
  • Mobile Communications
  • Networking
  • Notebook Computer
  • Optical
  • Optical Network
  • Optical Networks
  • Optical Receivers
  • Piezo Speakers, Microactuators
  • Power Management
  • Power Supply Monitor
  • Receiver
  • Receiver Signal Strength Indication (RSSI)
  • Security Systems
  • Shunt Regulators, Linear Power Supplies, Inverters, UPS
  • Signal Processing
  • Smart Card
  • Telecommunications
  • Telecommunications, Optical Networks
  • Testing Equipment
  • Transducer Amplifier
  • Ultrasound Imaging, Sonar
  • Winchester Servo Preamplifier

Mounting Type

  • -
  • Surface Mount
  • Surface Mount, Wettable Flank
  • Through Hole

Package / Case

  • -
  • 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
  • 10-VFQFN Exposed Pad
  • 10-WFDFN Exposed Pad
  • 100-TQFP Exposed Pad
  • 12-WFBGA, WLBGA
  • 12-WFDFN Exposed Pad
  • 12-WFQFN Exposed Pad
  • 121-BGA, CSPBGA
  • 13-SIP
  • 14-CDIP (0.300", 7.62mm)
  • 14-DIP (0.300", 7.62mm)
  • 14-SOIC (0.154", 3.90mm Width)
  • 14-TSSOP (0.173", 4.40mm Width)
  • 14-WFLGA Exposed Pad
  • 15-SSIP Exposed Tab, Formed Leads
  • 16-CDIP (0.300", 7.62mm)
  • 16-DIP (0.300", 7.62mm)
  • 16-SOIC (0.154", 3.90mm Width)
  • 16-SOIC (0.209", 5.30mm Width)
  • 16-SOIC (0.295", 7.50mm Width)
  • 16-SSOP (0.154", 3.90mm Width)
  • 16-TBGA
  • 16-TSSOP (0.173", 4.40mm Width)
  • 16-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • 16-UFQFN Exposed Pad, CSP
  • 16-VFQFN Exposed Pad
  • 16-VFQFN Exposed Pad, CSP
  • 16-VQFN Exposed Pad
  • 16-VQFN Exposed Pad, CSP
  • 16-WFQFN Exposed Pad
  • 16-WFQFN Exposed Pad, CSP
  • 16-WFQFN, CSP
  • 16-WQFN Exposed Pad
  • 20-CLCC
  • 20-SSOP (0.154", 3.90mm Width)
  • 20-SSOP (0.209", 5.30mm Width)
  • 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • 20-UFBGA, WLCSP
  • 20-VFQFN Exposed Pad
  • 20-WFQFN Exposed Pad
  • 20-WQFN Exposed Pad
  • 228-LFBGA, CSPBGA
  • 24-CDIP (0.600", 15.24mm)
  • 24-DIP (0.600", 15.24mm)
  • 24-VFQFN Exposed Pad
  • 24-VFQFN Exposed Pad, CSP
  • 24-WFQFN Exposed Pad
  • 24-WFQFN Exposed Pad, CSP
  • 28-CDIP (0.605", 15.37mm)
  • 28-TSSOP (0.173", 4.40mm Width)
  • 28-VFQFN Exposed Pad
  • 32-VFQFN Exposed Pad
  • 32-WFQFN Exposed Pad
  • 32-WFQFN Exposed Pad, CSP
  • 34-WFQFN Exposed Pad
  • 36-BSOP (0.295", 7.50mm Width)
  • 38-TFLGA Exposed Pad
  • 40-DIP (0.600", 15.24mm)
  • 44-CLCC (J-Lead)
  • 44-LCC (J-Lead)
  • 48-LQFP
  • 48-TQFP
  • 48-TQFP Exposed Pad
  • 54-WFQFN Exposed Pad
  • 56-WFQFN Exposed Pad
  • 6-UDFN Exposed Pad, CSP
  • 64-TQFP Exposed Pad
  • 64-VFQFN Exposed Pad, CSP
  • 68-WFQFN Exposed Pad
  • 8-DIP (0.300", 7.62mm)
  • 8-PowerSOIC (0.154", 3.90mm Width)
  • 8-SIP
  • 8-SMD, Gull Wing
  • 8-SOIC (0.154", 3.90mm Width)
  • 8-SOIC (0.154", 3.90mm Width) Exposed Pad
  • 8-SOIC (0.295", 7.50mm Width)
  • 8-SOIC (0.551", 14.00mm Width)
  • 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
  • 8-VFDFN Exposed Pad, CSP
  • 8-WDFN Exposed Pad
  • 8-WFBGA, WLBGA
  • 8-WFDFN Exposed Pad
  • 8-WFDFN Exposed Pad, CSP
  • 9-DIP Module
  • 9-WFBGA, CSPBGA
  • Die
  • SOT-23-8
  • SOT-23-8 Thin, TSOT-23-8
  • SOT-563, SOT-666
  • TO-263-15
  • TO-99-8 Metal Can

Supplier Device Package

  • -
  • 10-MSOP
  • 10-MSOP-EP
  • 10-QFN (3x2)
  • 10-SWTDFN (3x3)
  • 10-uMAX
  • 10-uMAX-EP
  • 10-uMAX/uSOP
  • 100-HTQFP (14x14)
  • 100-TQFP-EP (14x14)
  • 12-DFN (4x3)
  • 12-TQFN (3x3)
  • 12-WLP (2.14x1.56)
  • 121-CSP (9x9)
  • 13-SIPH
  • 14-CDIP
  • 14-CERDIP
  • 14-DIP
  • 14-LGA (2x3)
  • 14-PDIP
  • 14-SOIC
  • 14-TSSOP
  • 15-SIP
  • 16-CDIP
  • 16-CERDIP
  • 16-LFCSP (2.5x3)
  • 16-LFCSP (3x3)
  • 16-LFCSP-VQ (3x3)
  • 16-LFCSP-VQ (4x4)
  • 16-LFCSP-WQ (3x3)
  • 16-MLF® (3x3)
  • 16-PDIP
  • 16-QFN (3x3)
  • 16-QFN (4x4)
  • 16-QSOP
  • 16-SBDIP
  • 16-SO
  • 16-SOIC
  • 16-SSOP
  • 16-TFBGA (4x4)
  • 16-TQFN (3x3)
  • 16-TQFN (4x4)
  • 16-TQFN-EP (3x3)
  • 16-TQFN-SW (4x4)
  • 16-TSSOP
  • 16-TSSOP-EP
  • 16-VQFN (3x3)
  • 20-CLCC (9x9)
  • 20-LQFN (4x3)
  • 20-QFN (3x4)
  • 20-QFN (4x4)
  • 20-QSOP
  • 20-SSOP
  • 20-TQFN (4x4)
  • 20-TQFN (5x5)
  • 20-TQFN-EP (4x4)
  • 20-TSSOP-EP
  • 20-TSSOPJ
  • 20-WLCSP (2.04x1.64)
  • 228-CSBGA (16x10)
  • 24-CDIP
  • 24-LFCSP (4x4)
  • 24-LFCSP-VQ (4x4)
  • 24-LFCSP-WQ (4x4)
  • 24-Power-TAB DIP
  • 24-QFN (3x5)
  • 24-QFN (4x4)
  • 24-TQFN (4x4)
  • 24-TQFN-EP (4x4)
  • 24-VQFN (4x4)
  • 24-VQFN (5x4)
  • 28-CDIP
  • 28-QFN (5x5)
  • 28-TSSOP
  • 28-VQFN (5x4)
  • 32-LFCSP (5x5)
  • 32-LFCSP-WQ (5x5)
  • 32-VQFN (4x4)
  • 32-VQFN (5x5)
  • 32-WQFN (5x5)
  • 34-QFN (4x7)
  • 36-SSOP
  • 38-LGA (10.5x5.5)
  • 40-PDIP
  • 44-JLCC (16.39x16.39)
  • 44-PLCC (16.59x16.59)
  • 48-LQFP (7x7)
  • 48-TQFP (7x7)
  • 48-TQFP-EP (7x7)
  • 54-WQFN (10x5.5)
  • 56-TQFN (8x8)
  • 6-LFCSP-UD (2x2)
  • 64-LFCSP-VQ (9x9)
  • 64-TQFP-EP (10x10)
  • 68-TQFN (10x10)
  • 68-TQFN-I (10x10)
  • 8-DFN (2x3)
  • 8-DFN (3x3)
  • 8-DIP Gull Wing
  • 8-LFCSP (3x3)
  • 8-LFCSP-VD (3x2)
  • 8-MSOP
  • 8-MSOP-EP
  • 8-PDIP
  • 8-SIP
  • 8-SO
  • 8-SO PowerPad
  • 8-SOIC
  • 8-SOIC-EP
  • 8-SOIC-IC
  • 8-TDFN (3x3)
  • 8-uMAX/uSOP
  • 8-VSSOP
  • 8-WLP (1.72x1.21)
  • 8-WSON (2.5x3)
  • 8-µMAX
  • 9-UCSP (1.52x1.52)
  • DDPAK
  • Die
  • Diesale
  • SOT-23-8
  • SOT-563
  • TO-99-8
  • TSOT-23-8
  • Wafer

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Products - Record(s)

Bushings, Grommets

Bushinas and Grommets are used to insulate between an opening in a panel and anycharacteristics are bushing/grommet type, panel thickness, panel cutout dimensions,diameterinside and materie<br />(most often cables and wire) that are inserted into the opening. These devices can also hold the inserted objects securely between the two sides of the opening. The